|
| Depth |
1.4 .. 10 µm |
|---|
| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
AZ 312/water [1:1] |
|---|
| Etch type |
wet isotropic |
|---|
| Material |
AZ 5214e |
|---|
| Temperature |
20 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Suss ACS200 Wafer Coater / Developer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 75 mm: 25 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
cassette |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
274 .. 700 µm |
|---|
