on front Contact photolithography (Manual - Negative) |
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Process characteristics: |
Alignment type Method used to align materials to be bonded. |
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Perform hardbake 100mm and 150mm diameter wafers only. |
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Perform linewidth metrology Two measurement per wafer |
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Perform microscope inspection 30 mins inspection per wafer |
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Perform stylus profilometry One measurement per wafer |
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Resist thickness |
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Batch size |
1 |
Magnification |
1 |
Material |
Futurrex NR5-8000 |
Photoresist polarity |
negative |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm, 150 mm |
Wafer size |
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Comments: |
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