on front G-line BCB develop (BCB4000) |
|
| Batch size |
10 |
|---|
| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
DS2100 |
|---|
| Duration |
90 s |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
MTI BCB coater |
| Equipment characteristics: |
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
plastic chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, sapphire, quartz (single crystal), silicon germanium, Foturan (Schott), quartz (fused silica), fused silica, ceramic, glass-ceramic, silicon on insulator, alumina, glass (Hoya), silicon on sapphire, Corning 1737, Borofloat (Schott), Pyrex (Corning 7740), silicon carbide |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1100 µm |
|---|
