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About MEMS
Silicon Cap wafer preparation: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
Anisotropic etch
Deep RIE
Isotropic etch
Miscellaneous etch
Strip
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Silicon Cap wafer preparation
Process characteristics:
Cavity etch
Mark yes, if you wish to have a partial etch in the substrate to create cavities.
Cavity etch
*
yes
no
Mark yes, if you wish to have a partial etch in the substrate to create cavities.
Depth
Depth of cavity. Depth < thickness of wafer for partial etch.
Depth
*
µm
Depth of cavity. Depth < thickness of wafer for partial etch., must be 50 .. 350 µm
50 .. 350 µm
Through wafer etch
Mark yes, if you wish to create holes that go completely through the substrate.
Through wafer etch
*
yes
no
Mark yes, if you wish to create holes that go completely through the substrate.
Etch type
dry anisotropic
Material
silicon
Comments:
This module allow preparation of silicon cap wafer for packaging applications.
This modules requires a mask.