on front Spectrophotometric film thickness measurement |
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| Materials |
polyimide on silicon, phosphosilicate glass on silicon, photoresist on silicon dioxide, borophosphosilicate glass on silicon, silicon nitride on silicon, photoresist on silicon nitride, photoresist on quartz, amorphous silicon on quartz, silicon dioxide on silicon, polyimide on silicon nitride, polysilicon on silicon dioxide, platinum on silicon dioxide, amorphous silicon on silicon, silicon nitride on quartz, amorphous silicon on silicon dioxide, photoresist on silicon |
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| Sides processed |
either |
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| Thickness |
20 .. 5000 nm |
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| Wafer size |
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| Equipment |
Nanometrics NanoSpec |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1 |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 2000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |
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| Extra terms |
No materials with Gold contamination will be processed at this fab site. Certain services (for example, oxidation, diffusion, and sputter deposition) will be provided if wafers are virgin, or all pre-processing steps have been performed at this fab site. |
