Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  5X stepper alignment and i-line exposure
Magnification 5
Material Arch OiR 897-10i
Max field size 10 mm
Min feature size 1 µm
Setup time 30 min
Sides processed either
Wavelength
Wavelength of light used during the exposure
 365 nm
Wafer size
Wafer size
Equipment GCA 8500 wafer stepper (5x i-line)
Equipment characteristics:
Batch sizes 150 mm: 1
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 500 .. 700 µm