Process Hierarchy

  Photoresist wet strip
Ambient to which substrate is exposed during processing
EKC 265
Material photoresist (category)
Temperature 70 °C
Wafer size
Wafer size
Equipment Solvent bench #1
Equipment characteristics:
Batch sizes 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, Corning Eagle 2000, silicon, Corning 1737, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm