Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  HF dip
Depth 1 .. 30 nm
Etch type wet isotropic
Etchant
Solutions and their concentrations.
 HF/water [1:10]
Material silicon dioxide
Sides processed both
Temperature 25 °C
Wafer size
Wafer size
Equipment Wet bench #1
Equipment characteristics:
Batch sizes 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 fused silica, Corning Eagle 2000, silicon, Corning 1737, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 675 µm