Process Hierarchy

  KOH Silicon etch
Process characteristics:
Depth of material removed by etch process
Depth of material removed by etch process, must be 0 .. 600 µm
0 .. 600 µm
Etch rate 1.67 µm/min
Material silicon
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
silicon: 1
Sides processed both
Temperature 80 °C
Wafer size
Wafer size
Equipment Wet bench #1
Equipment characteristics:
Batch sizes 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, Corning Eagle 2000, silicon, Corning 1737, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm