Process Hierarchy

on front
  Sheet resistance measurement
Current 1e-06 .. 0.2 A
Materials silicon (doped), metal (category)
Sheet resistance 0.005 .. 1e+06 Ω/square
Sides processed either
Voltage 1e-06 .. 1 V
Wafer size
Wafer size
Equipment CDE ResMap 168 Resistivity measurement
Equipment characteristics:
Batch sizes 150 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm