Process Hierarchy

  Aluminum RIE
Process characteristics:
must be 0.01 .. 1 µm
0.01 .. 1 µm
Etch rate 0.9 µm/min
Gas BCl3, Cl2, He
Material aluminum
Temperature 40 °C
Uniformity 0.05
Wafer size
Wafer size
Equipment LAM 9600
Equipment characteristics:
Batch sizes 150 mm: 1
Wafer geometry
Types of wafers this equipment can accept
Wafer holder
Device that holds the wafers during processing.
electrostatic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, fused silica, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 900 µm