Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Plastic MEMS (PMEMS)
Design area
Active design area per chip site in a multi-user project runs
 20 mm x 20 mm
Die count
Number of fabricated dies per chip site
 10
Substrate material silicon
Comments:
  • Plastic microelectromechanical systems (PMEMS) process has been developed for microfluidics and bioMEMS applications. The fabrication process mainly uses parylene to form channels and SU-8 to planarize the surface for external tube coupling. This process is a low temperature process (maximum temperature of 90 °C) and can use any substrate including plastic, glass and silicon. Therefore, it is CMOS compatible and can be used to integrate microfluidics with CMOS. Furthermore, by using plastic substrates, cheap and disposable microfluidic devices can be fabricated.
  • Parylene can also be used as a mechanical material to fabricate surface micromachined beams, diaphragms and cantilevers for applications that require low Young’s modulus. Therefore, parylene technology can be used as a platform to integrate CMOS and electrodes, heaters, microchannels, cantilevers, beams and diaphragms.
  • Deadlines for the next run:
    Process Will Begin at Michigan: January 31, 2006
    Chips Returned to Customers: March 31, 2006
Attachments
PMEMS_design_rules_Final.doc (706.5 KB, application/msword)
attached by ozgur (Mehmet Ozgur) on 2007-04-23 14:13
[Thumbnail]pmems_lr.jpg (228.8 KB, image/jpeg)
attached by ozgur (Mehmet Ozgur) on 2005-09-28 17:11
Process flow