Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  HF Vapor Etch
Process characteristics:
Depth
Depth*
must be 0 .. 50 µm
0 .. 50 µm
Batch size 1
Etch type dry isotropic
Materials silicon dioxide (category), silicon dioxide
Sides processed either
Equipment