Process Hierarchy

on front
  Hot Embossing
Process characteristics:
Cycle Time
Cycle Time*
must be 0 .. 300 min
0 .. 300 min
Embossing Material
Embossing Material
Stamp Material
Stamp Material
Aspect ratio 7
Batch size 1
Contact force
Force applied at contact point
0 .. 200000 N
Min feature size 1 µm
Sides processed either
Temperature 23 .. 500 °C
Equipment Jenoptik Hex 03
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
4 mm