Process Hierarchy

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  Photoresist develop (manual)
Batch size 12
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
MIF300 developer
Material photoresist (category)
Process duration 30 .. 200 s
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
photoresist (category): 1
Sides processed either
Wafer size
Wafer size
Equipment Solvent wet bench
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm