on front 4X DUV (193nm) photolithography |
|
| Magnification |
4 |
|---|
| Min feature size |
0.1 µm |
|---|
| Photoresist thickness Thickness of photoresist mold. |
0.24 µm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
ASML 5500/950B 193 nm Stepper |
| Equipment characteristics: |
| Batch sizes |
150 mm: 6 |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
550 .. 700 µm |
|---|
| Comments: |
|
