Process Hierarchy

on front
  4X DUV (193nm) photolithography
Magnification 4
Min feature size 0.1 µm
Photoresist thickness
Thickness of photoresist mold.
0.24 µm
Sides processed either
Wafer size
Wafer size
Equipment ASML 5500/950B 193 nm Stepper
Equipment characteristics:
Batch sizes 150 mm: 6
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
550 .. 700 µm
  • This includes BARC deposition and etching.