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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
SU-8 |
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| Etch type |
wet isotropic |
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| Material |
SU-8 |
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| Resist thickness |
30 .. 100 µm |
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| Temperature |
20 °C |
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| Wafer size |
|
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| Equipment |
Wet bench |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1 |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), silicon carbide, silicon on insulator, quartz (single crystal), sapphire, silicon, Pyrex (Corning 7740), gallium arsenide, indium phosphide |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
250 .. 800 µm |
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