Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Dicing (EO)
Process characteristics:
Time
Time*
must be 0 .. 40 hour
0 .. 40 hour
Batch size 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 10 .. 150 mm
Wafer size
Wafer size
Equipment