Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Locker release (LC)
Process characteristics:
Substrate diameter
List or range of wafer diameters the tool can accept
Substrate diameter*
List or range of wafer diameters the tool can accept
Allowed materials chromium, gold, silicon dioxide, photoresist (category), platinum
Batch size 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
 5 .. 100 mm
Substrate material silicon
Comments:
  • Minimum order amount corresponds to 2 items (wafers or pieces).