Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Direct laser write
Process characteristics:
Min feature size
Min feature size
must be 0.5 .. 10 µm
0.5 .. 10 µm
Time
Estimated write time per wafer
Time*
Estimated write time per wafer, must be 15 .. 480 min
15 .. 480 min
Alignment tolerance
Registration of CAD data to features on wafer
 100 .. 250 nm
Sides processed either
Wafer size
Wafer size
Equipment Heidelberg VPG200++
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1
File formats
List of CAD file formats supported (eg. GDSII, CIF)
 cif
Mask plate dimensions
Width, length, thickness of the mask plates (eg. 5x7x0.09 inch).
 200mm x 200mm
Max field size 200 mm
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 2000 µm