Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Direct laser write lithography (Automated)
  1 HMDS Vapor Prime
on front
  2 Photoresist Spin Coat ACS200 (AZ 5214E)
  3 Photoresist Softbake ACS200
on front
  4 Direct laser write
  5 Photoresist Develop (5214E)
Process characteristics:
Min feature size
Min feature size*
must be 0.5 .. 10 µm
0.5 .. 10 µm
Perform edge bead removal
Perform edge bead removal*
yes no
Perform linewidth metrology
Perform linewidth metrology*
yes no
Perform microscope inspection
One measurement per wafer
Perform microscope inspection*
yes no
One measurement per wafer
Perform stylus profilometry
Perform stylus profilometry*
yes no
Resist thickness
Resist thickness*
must be 1 .. 5 µm
1 .. 5 µm
Time
Time*
must be 15 .. 480 min
15 .. 480 min
Alignment side front
Batch size 1
Magnification 1
Material AZ 5214e
Perform hardbake yes
Wafer size
Wafer size