Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Photoresist coat (Shipley 3612)
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer
Batch size 25
Material Shipley 3612
Process duration 100 min
Sides processed either
Temperature 90 °C
Wafer size
Wafer size
Equipment SVG Autocoater 8626
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 550 µm
Comments:
  • Requires dehydration bake prior to coat