Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Lift-off etch
Process characteristics:
Depth
Depth
must be 1 .. 5 µm
1 .. 5 µm
Batch size 5
Etchant
Solutions and their concentrations.
 acetone
Excluded materials gold (category), copper
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Material Shipley 1813
Sides processed both
Wafer size
Wafer size
Equipment Microvoid Fume Hood
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 teflon
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, silicon dioxide, alumina, Borofloat (Schott)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm
Comments:
  • This is only the etch step of the lift-off procedure. prerequisites: None
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.