|
| Process characteristics: |
| Depth |
|
|---|
| Batch size |
5 |
|---|
| Etchant Solutions and their concentrations. |
acetone |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Material |
Shipley 1813 |
|---|
| Sides processed |
both |
|---|
| Wafer size |
|
|---|
| Equipment |
Microvoid Fume Hood |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon dioxide, alumina, Borofloat (Schott) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
| Comments: |
|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
