Process Hierarchy

on front
  Spectroscopic ellipsometry film thickness measurement
Batch size 1
Refractive index 1 .. 4
Sides processed either
Thickness 0.01 .. 5 µm
Wafer size
Wafer size
Equipment Gaertner Ellipsometer
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 800 µm