Process Hierarchy

  Clean 100 III-V Oven Bake
Process characteristics:
must be 75 .. 150 °C
75 .. 150 °C
Batch size 10
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, indium phosphide
Wafer size
Wafer size
Equipment Clean 100 Photoresist Bake Oven
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm