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About MEMS
Dehydration bake: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Anneal
Bake
Oxidation
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Dehydration bake
Ambient
Ambient to which substrate is exposed during processing
nitrogen
Batch size
1
Pressure
Pressure of process chamber during processing
1 atm
Process duration
30 min
Sides processed
both
Temperature
150 °C
Wafer size
Wafer size
75 mm
100 mm
Equipment
Singe oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, quartz (single crystal), germanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 550 µm