Process Hierarchy

  Dehydration bake
Ambient to which substrate is exposed during processing
Batch size 1
Pressure of process chamber during processing
1 atm
Process duration 30 min
Sides processed both
Temperature 150 °C
Wafer size
Wafer size
Equipment Singe oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, quartz (single crystal), germanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 550 µm