Process Hierarchy

on front
  Titanium DC-magnetron sputtering
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0 .. 0.35 µm
0 .. 0.35 µm
Ambient to which substrate is exposed during processing
Material titanium
Setup time 90 min
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment CPA 9900 3-Target Sputtering System
Equipment characteristics:
Batch sizes 100 mm: 9, 150 mm: 2
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm