Process Hierarchy

  Post exposure bake (SU-8)
Batch size 1
Sides processed both
Temperature 25 .. 150 °C
Wafer size
Wafer size
Equipment Lab-Line programmable oven
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 3000 µm