Process Hierarchy

  Photoresist softbake (Shipley 1813)
Ambient to which substrate is exposed during processing
Batch size 25
Excluded materials gold (category), copper
Loading effects
Free form text field for description of loading effects (e.g. bullseye)
Material Shipley 1813
Pressure of process chamber during processing
1 atm
Sides processed both
Temperature 95 °C
Thermal duration 30 min
Wafer size
Wafer size
Equipment Blue M CC04-C-P-B
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon dioxide, alumina
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm
  • Softbake of 1.3 and 2.5 micron thick photoresist
Extra terms