Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Resist bonding
Process characteristics:
1st bonded material
Specify first material in bonded pair.
1st bonded material
Specify first material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
Alignment tolerance
Tolerance of alignment if needed.
Alignment tolerance
Tolerance of alignment if needed.
unconstrained
Alignment type
Method used to align materials to be bonded.
Alignment type
Method used to align materials to be bonded.
Ambient
Preferred environment for curing of resist (if known).
Ambient
Available  
Selected
Preferred environment for curing of resist (if known).
Bond strength
Required strength of bond (if known).
Bond strength
Required strength of bond (if known).
unconstrained
Contact force
Preferred contact force applied when bonding materials (if known).
Contact force
Preferred contact force applied when bonding materials (if known).
unconstrained
Material
Specify preferred photoresist bonding material (if known).
Material
Specify preferred photoresist bonding material (if known).
Temperature
Preferred curing temperature for photoresist (if known).
Temperature
Preferred curing temperature for photoresist (if known).
unconstrained
Equipment
Comments:
  • The substrates are bonded together using photoresist. This is typically done by spin coating a thin film of resist on one or both substrates before they are brought into contact. The substrates are baked to cure the resist.