Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Microwave bonding
Process characteristics:
1st bonded material
Specify first material in bonded pair.
1st bonded material
Specify first material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
Alignment tolerance
Tolerance of alignment if needed.
Alignment tolerance
Tolerance of alignment if needed.
unconstrained
Alignment type
Method used to align materials to be bonded.
Alignment type
Method used to align materials to be bonded.
Ambient
Preferred bonding environment (if known).
Ambient
Available  
Selected
Preferred bonding environment (if known).
Bond strength
Required strength of bond (if known).
Bond strength
Required strength of bond (if known).
unconstrained
Contact force
Preferred contact force applied when bonding materials (if known).
Contact force
Preferred contact force applied when bonding materials (if known).
unconstrained
Temperature
Preferred bonding temperature (if known).
Temperature
Preferred bonding temperature (if known).
unconstrained
Equipment