Process Hierarchy

  Spectrophotometric film thickness measurement
Process characteristics:
Film thickness 5 .. 5000 nm
Wafer size
Wafer size
Equipment Nanometrics NanoSpec 3000PHX
Equipment characteristics:
Batch sizes 50 .. 150 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).