Process Hierarchy

  Photoresist develop (SU-8)
Batch size 1
Depth 200 µm
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
MicroChem SU-8 Developer
Material SU-8
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
SU-8: 1
Sides processed both
Temperature 25 °C
Wafer size
Wafer size
Equipment Solitec 5100
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • Exposed photoresist.