Process Hierarchy

  Hard bake
Batch size 25
Process duration 25 min
Sides processed both
Temperature 110 °C
Thermal duration 25 min
Wafer size
Wafer size
Equipment Post-exposure bake oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), quartz (single crystal), gallium arsenide, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • Other wafer sizes can be accommodated, but wafers will be placed flat on a piece of foil (not loaded in a cassette).