Process Hierarchy

  Post exposure bake
Sides processed both
Temperature 100 °C
Thermal duration 30 s
Wafer size
Wafer size
Equipment Hotplate
  • Programable hotplate
Equipment characteristics:
Batch sizes 100 mm: 6, 150 mm: 4, 200 mm: 1, 75 mm: 6
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, gallium arsenide, glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 3000 µm