on front Contact exposure |
|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Quintel UV Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass-ceramic, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1500 µm |
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