Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact exposure
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Sides processed either
Wafer size
Wafer size
Equipment Quintel UV Aligner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
 aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass-ceramic, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1500 µm