on front Photoresist descum |
|
| Material |
photoresist (category) |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Technic Micro RIE 800
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| Equipment characteristics: |
| Batch sizes |
100 mm: 2, 150 mm: 1, 200 mm: 1, 75 mm: 4 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
plate |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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