|
| Field geometry Shape of field with dimensions characterized by the maximum field size |
square |
|---|
| Focal depth Depth of focus of a single objective at a single setting (include objective) |
400 .. 1000 µm |
|---|
| Material |
PMMA |
|---|
| Max field size |
60 mm |
|---|
| Min feature size |
5 µm |
|---|
| Sides processed |
either |
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| Wafer size |
|
|---|
| Equipment |
X-ray beam line |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
500 .. 1000 µm |
|---|
| Comments: |
|
