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| Process characteristics: |
| Material Material to be deposited. |
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| Microstructure Specify preferred microstructure of deposited film (if known).
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| Residual stress Specify preferred residual stress in deposited film (if known). Positive values refer to tensile film stress. |
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| Sides processed Specify whether deposition is to occur on a single or both sides of substrate. |
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| Thickness Thickness of film to be deposited. |
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| Equipment |
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