Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Adhesive bonding
Process characteristics:
1st bonded material
Specify first material in bonded pair.
1st bonded material
Specify first material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
Alignment tolerance
Preferred tolerance if alignment is required.
Alignment tolerance
Preferred tolerance if alignment is required.
unconstrained
Alignment type
Method used to align materials to be bonded.
Alignment type
Method used to align materials to be bonded.
Ambient
Preferred curing environment (if known).
Ambient
Available  
Selected
Preferred curing environment (if known).
Bond strength
Required strength of bond (if known).
Bond strength
Required strength of bond (if known).
unconstrained
Contact force
Preferred force to be applied when bonding materials (if known).
Contact force
Preferred force to be applied when bonding materials (if known).
unconstrained
Temperature
Preferred curing temperature for adhesive (if known).
Temperature
Preferred curing temperature for adhesive (if known).
unconstrained
Equipment
Comments:
  • The substrates are bonded together using an adhesive. This is typically done by spin coating a thin film of adhesive on one or both substrates before they are brought into contact. The substrates are baked to cure the adhesive.