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About MEMS
Adhesive bonding: View
Process Hierarchy
Bonding
Anodic bonding
Fusion bonding
Glass frit bonding
Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Adhesive bonding
Process characteristics:
1st bonded material
Specify first material in bonded pair.
1st bonded material
ABS_plastic
alumina
BK7
Borofloat (Schott)
ceramic
copper
Corning 1737
Corning 7070 Glass
Corning Eagle 2000
Foturan (Schott)
fused silica
gallium arsenide
gallium phosphide
germanium
glass (Hoya)
glass-ceramic
indium phosphide
lanthanum aluminate
lithium niobate
nickel
niobium
nitride on silicon
other
oxidized silicon
PEEK
PET
Phosphate Glass
platinized silicon
PMMA
polycarbonate
polyester
polyethylene
polypropylene
polystyrene
Pyrex (Corning 7740)
PZT
quartz (fused silica)
quartz (single crystal)
sapphire
SF4 Glass
silicon
silicon carbide
silicon germanium
silicon on insulator
silicon on sapphire
titanium
YSZ (Yttria-Stabilized Zirconia)
Zeonor
ZnSe
Specify first material in bonded pair.
2nd bonded material
Specify second material in bonded pair.
2nd bonded material
ABS_plastic
alumina
BK7
Borofloat (Schott)
ceramic
copper
Corning 1737
Corning 7070 Glass
Corning Eagle 2000
Foturan (Schott)
fused silica
gallium arsenide
gallium phosphide
germanium
glass (Hoya)
glass-ceramic
indium phosphide
lanthanum aluminate
lithium niobate
nickel
niobium
nitride on silicon
other
oxidized silicon
PEEK
PET
Phosphate Glass
platinized silicon
PMMA
polycarbonate
polyester
polyethylene
polypropylene
polystyrene
Pyrex (Corning 7740)
PZT
quartz (fused silica)
quartz (single crystal)
sapphire
SF4 Glass
silicon
silicon carbide
silicon germanium
silicon on insulator
silicon on sapphire
titanium
YSZ (Yttria-Stabilized Zirconia)
Zeonor
ZnSe
Specify second material in bonded pair.
Alignment tolerance
Preferred tolerance if alignment is required.
Alignment tolerance
µm
Preferred tolerance if alignment is required.
unconstrained
Alignment type
Method used to align materials to be bonded.
Alignment type
flat
IR
optical
unaligned
Method used to align materials to be bonded.
Ambient
Preferred curing environment (if known).
Ambient
Available
nitrogen
other
Selected
air
Preferred curing environment (if known).
Bond strength
Required strength of bond (if known).
Bond strength
MPa
psi
Required strength of bond (if known).
unconstrained
Contact force
Preferred force to be applied when bonding materials (if known).
Contact force
N
Preferred force to be applied when bonding materials (if known).
unconstrained
Temperature
Preferred curing temperature for adhesive (if known).
Temperature
°C
Preferred curing temperature for adhesive (if known).
unconstrained
Equipment
Comments:
The substrates are bonded together using an adhesive. This is typically done by spin coating a thin film of adhesive on one or both substrates before they are brought into contact. The substrates are baked to cure the adhesive.