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About MEMS
Dehydration bake: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Anneal
Bake
Oxidation
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Dehydration bake
Process characteristics:
Ambient
Preferred baking environment (if known).
Ambient
Available
air
argon
helium
hydrogen
nitrogen
oxygen
steam
Selected
other
Preferred baking environment (if known).
Pressure
Preferred oven pressure (if known).
Pressure
atm
bar
mTorr
Pa
Preferred oven pressure (if known).
unconstrained
Process duration
Specify preferred baking time (if known).
Process duration
hour
min
s
Specify preferred baking time (if known).
unconstrained
Temperature
Preferred baking temperature (if known).
Temperature
°C
Preferred baking temperature (if known).
unconstrained
Sides processed
both
Equipment