Register
or
Sign in
Advantages
Capabilities
Company
How to Start
About MEMS
Anneal: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Anneal
Bake
Oxidation
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Anneal
Process characteristics:
Ambient
Preferred annealing environment (if known).
Ambient
Available
air
argon
helium
hydrogen
nitrogen
oxygen
steam
Selected
other
Preferred annealing environment (if known).
Pressure
Preferred annealing chamber pressure (if known).
Pressure
atm
bar
mTorr
Pa
Preferred annealing chamber pressure (if known).
unconstrained
Process duration
Specify preferred annealing time (if known).
Process duration
hour
min
s
Specify preferred annealing time (if known).
unconstrained
Temperature
Preferred annealing temperature (if known).
Temperature
°C
Preferred annealing temperature (if known).
unconstrained
Sides processed
both
Equipment