on front Contact front-to-front Align & Expose |
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| Alignment tolerance Registration of CAD data to features on wafer |
1 µm |
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| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
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| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
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| Max field size |
200 mm |
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| Min feature size |
1 .. 5 µm |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
ABM Contact aligner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 200 mm: 1, 25 mm: 1, 50 mm: 1, 75 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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| Comments: |
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