Process Hierarchy

on front
  Contact front-to-front Align & Expose
Alignment tolerance
Registration of CAD data to features on wafer
1 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Field geometry
Shape of field with dimensions characterized by the maximum field size
Max field size 200 mm
Min feature size 1 .. 5 µm
Sides processed either
Wafer size
Wafer size
Equipment ABM Contact aligner
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1, 25 mm: 1, 50 mm: 1, 75 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm