|
| Batch size |
25 |
|---|
| Material |
HMDS |
|---|
| Pressure Pressure of process chamber during processing |
12 .. 24 inHg |
|---|
| Process duration |
45 min |
|---|
| Sides processed |
either |
|---|
| Temperature |
125 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
SVG Autocoater 8626 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 550 µm |
|---|
