Process Hierarchy

on front
  Photoresist coat (Shipley 1827)
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 3 .. 24 µm
3 .. 24 µm
Material Shipley 1827
Microstructure amorphous
Sides processed either
Wafer size
Wafer size
Equipment Photoresist Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 75 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular, other
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm
  • Thicker films may require multiple spins.
  • Small features only available with thinner resist films.