Process Hierarchy

on front
  Optical surface profilometry
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Min feature size 1 µm
Sides inspected
The sides of the wafer inspected by the process
Vertical resolution
Maximum vertical resolution of profiler.
0.1 nm
Wafer size
Wafer size
Equipment Wyko Optical Profiler
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
0.1 .. 4 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 20000 m
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, alumina, Borofloat (Schott), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire, stainless steel
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 2000 µm