|
| Sides processed |
both |
|---|
| Temperature |
115 °C |
|---|
| Thermal duration |
60 s |
|---|
| Wafer size |
|
|---|
| Equipment |
Hot plate |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 75 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular, triangular shard, irregular, other |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 2000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
heated plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 2000 µm |
|---|
